1. Wu Z, Liu F, Zhou J, Fan F, Wang Z. Path planning for autonomous vehicles under multi-road condition based on improved artificial potential field with A* algorithm. Proceedings of the Institution of Mechanical Engineers, Part D. 2025, 0(0). doi:10.1177/09544070251328138

2. Fang Liu, Runze Gong, Zhongwei Duan, Zhen Wang and Jiacheng Zhou. Research on vibration reliability of solder joint based on modal experiment of PCBA[J]. Journal of Materials Science: Materials in Electronics, 2025, 36:43.

3. Fang Liu, Runze Gong, Zhongwei Duan, Zhen Wang and Jiacheng Zhou. Effect of PCB fastening method and thickness on PCB assembly vibration[J]. Mircoelectronics Reliability, 2025, 165: 115587.

4. Fang Liu, Zhongwei Duan, Runze Gong, Jiacheng Zhou, Zhi Wu and Nu Yan. Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization [J]. Soldering & Surface Mount Technology, 2025, 37(1):25-36.

5. Fang Liu, Zilong Wang, Jiacheng Zhou, Yuqin Wu and Zhen Wang. Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder [J]. Soldering & Surface Mount Technology, 2024, 36(3):174-184.

6. Zilong Wang, Fang Liu, Jie Liu, Jiacheng Zhou, Zhen Wang, and Nu Yan. Influences of rotating magnetic field on microstructure and properties of Sn–Ag–Cu–Sb–Ce solder alloy[J]. Journal of Materials Science: Materials in Electronics, 2023, 34:504.

7. Zilong Wang, Jiacheng Zhou, Fang Liu, Yuqin Wu and Nu Yan. Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys [J]. Soldering & Surface Mount Technology, 2023, 35(2):106-114.

8. Liu Fang, Zhou Jiacheng, Yan Nu. Thermal cycling effect on the drop reliability of BGA lead-free solder joints, Soldering &Surface Mount Technology. 2017, 29(4): 199-202.

9. Liu Fang, Ye Lu，Zhen Wang, Zhiming Zhang. Numerical simulation and fatigue life estimation of BGA packages under random vibration loading. Microelectronics Reliability, 2015, 55(12): 2777-2785.

10. Liu Fang, Meng Guang. Random vibration reliability of BGA lead-free solder joint, Microelectronics Reliability, 2014, 54(1): 226-232.

11. Liu Fang，Fan Rongping. Experimental Modal Analysis and Random Vibration Simulation of Printed Circuit Board Assembly, Advances in Vibration Engineering, 2013, 12(5): 489- 498.

12. Liu Fang, Meng Guang, Zhao Junfeng. An alternative JEDEC test board design and analysis. Soldering &Surface Mount Technology. 2013, 25(3): 155-163.

13. Liu Fang, Meng Guang, Zhao Mei. Experimental investigation on the failure of lead-free solder joints under drop impact. Soldering &Surface Mount Technology. 2010, 22(3): 36-41.

14. Liu Fang, Meng Guang Zhao Mei, Zhao Junfeng. Experimental and numerical investigation of BGA lead-free solder joint reliability under board-level drop impact. Microelectronics Reliability，2009, 49(1): 79-85.

15. Liu Fang, Meng Guang, Zhao Mei, Zhao Junfeng. Board level drop test analysis based on modal test and simulation. ASME Journal of Electronic Packaging. 2008, 130 (2): 021007(1-6).

16. Liu Fang, Chen Li-Qun. Complex Modal Analysis for Vibration of Damped Continua. Advances in Vibration Engineering, 2008, 7(3): 283-291.

17. Liu Fang, Meng Guang, Zhao Mei. Viscoelastic influence on dynamic properties of PCB under drop impact. ASME Journal of Electronic Packaging. 2007, 129(3): 266-272.

18. Wu Yu-qin，Tian Ze-an，Liu,Fang, Yuan, Zi-Hou,Chen, Wei, Zhang, Chi; Li, Cheng-xin. Effect of magnetic field on microstructure and property of Ag-Sn solder alloys, Materials Letters, 2021, 303: 0-130515

19. You Mingyi, Liu Fang, Wang Wen, Meng Guang.Statistically Planned and Individually Improved Predictive Maintenance Management for Continuously Monitored Degrading Systems. IEEE Transactions on Reliability, 2010, 59(4): 744-753.

20. You Mingyi, Liu Fang., Meng Guang. Benefits from condition monitoring techniques: a case study on maintenance scheduling of ball grid array solder joints Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering , 2011, 225(E3): 205-215.

21. You Mingyi, Liu Fang, Meng Guang. Proportional hazards model for reliability analysis of solder joints under various drop-impact and vibration conditions. Proceedings of the Institution of Mechanical Engineers Part O-Journal of Risk and Reliability, 2012, 226(O2): 194-202.

22. 刘芳, 赵玫 孟光 电路板组件板级跌落冲击动力学分析. 机械强度, 2007，29(5):713-716.

23. 刘芳, 孟光，赵玫. 跌落碰撞下SMT焊点可靠性研究进展. 振动与冲击, 2007, 6(10): 92- 95.

24. 刘芳，孟光，赵玫，赵峻峰. 板级跌落碰撞下无铅焊点的可靠性研究. 电子学报，2007, 35(11):2083-2086.

25. 刘芳，孟光，赵玫，赵峻峰. 板级跌落碰撞下无铅焊点的有限元分析. 振动与冲击, 2008, 27(2): 75-77.

26. 刘芳，孟光，王文. 跌落碰撞下球栅阵列无铅焊点失效分析. 上海交通大学学报, 2009, 43(5): 727-730.

27. 刘芳，孟光，赵玫. 球栅阵列无铅焊点随机振动失效研究. 振动与冲击, 2011, 30(6): 269- 271+276.

28. 刘芳，孟光. 跌落碰撞下球栅阵列无铅焊点寿命分析. 机械强度，2012，34(3): 403-409.

29. 刘芳, 孟光. 随机振动载荷下电路板组件三维有限元模拟，振动与冲击，2012, 31(20): 61- 64.

30. 王文, 刘芳, 尤明懿, 孟光. 板级球栅阵列无铅焊点随机振动寿命分析. 上海交通大学学报, 2011，45 (9): 1362-1367.